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CAREERS
We are currently seeking qualified people with optoelectronic experience to join our team.
09-002 Sr. Scientist/VCSEL Device Designer
09-003 Photonic Reliability Engineer
09-004 Photonic Packaging Engineer
09-005 Camera Engineering Lead
09-006 Board Design/Systems Engineer
09-002 Sr. Scientist/VCSEL Device Designer
The research engineer will design new devices and initiate improvements on existing device designs through theoretical methods. Will design and build specialized engineering test stations and perform advanced testing of these new devices. Will focus on the design and testing of high power Vertical Cavity Surface Emitting Lasers (VCSELs) and high power VCSEL arrays. The design/test work includes optoelectronic, electrical and thermal properties of the device. The research engineer will work closely with the semiconductor growth and processing engineers as well as test and packaging engineers to improve device performance.
Responsibilities-
Model optical, thermal, and electrical properties of GaAs and InP semiconductor based devices (with special focus on new VCSEL structures and VCSEL arrays).
Test optical, thermal and electrical properties of new GaAs and InP semiconductor based devices (including design of test set-up).
Analyze test data and work with wafer fab engineers to improve critical metrics of devices.
Work with other engineers in a team to improve and understand device properties
- Familiar with Finite Element Analysis (FEA) modeling software (such as ANSYS or COMSOL)
- Familiar with Matlab or Mathematica
- Familiar with LabView
- Familiar with a programming language such as VB or C (or its variants)
- Strong in semiconductor device physics, particularly optoelectronic/photonic devices
- Experience with growth, wafer processing, packaging, and testing is a plus
- Ph.D. in Electrical Engineering, Physics, or Mechanical Engineering with 3 years experience in semiconductor device modeling
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09-003 Photonic Reliability Engineer
Responsibilities- Lead reliability work and qualification of wavelength tunable laser chip and package
- Effectively communicate reliability of complex, new type of laser chip to customers
- Failure Reliability, and Materials Characterization in Semiconductor Process Development, Manufacturing, and Reliability Qualification
- Experience in Semiconductor technology: CMOS, III-V, HEMT, Lasers, IR Detectors, Power Diodes, AMLCD
- Root Cause Analysis, Failure Mode Effects and Analysis (FMEA), Design of Experiment (JMP)
- Design for Reliability and Reliability Testing, Qualification and Statistical analysis of ICs
- Expert in Focused Ion Beam (FIB), Scanning and Transmission Electron Microscopy (SEM, HRTEM) of different materials and devices
- TEM samples preparation and examination, Cross-Sections, Reverse Engineering
- PhD, Materials Engineering, Electrical Engineering or equivalent
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09-004 Packaging Engineer
Responsibilities- Hands-on development of optical packaging, including process development for transfer to manufacturing
- Carry out processes associated with diode laser mounting, packaging, optical assembly alignment, epoxy application, optical precision alignment, and dimensional verification
- Develop tooling for assembly processes
- Document detailed work instructions and travelers for production processes
- 3+ years experience with packaging experience
- Knowledge of backend manufacturing processes and assembly of precision assemblies and wire bonding techniques
- Experience working in a clean room environment
- Computer proficiency
- Good communication skills and attention to details
- Thermal analysis
- M.S. or B.S. in Engineering or Physics or equivalent experience
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09-005 Camera Engineering Lead Aerius Photonics, LLC
Aerius Photonics, LLC is seeking a camera electronics engineer to join the engineering team. Aerius Photonics is a growing engineering company providing optical products for industrial and military applications. The responsibilities and experience for the job are shown below. Aerius Photonics offers competitive salaries and benefits.
Responsibilities- Designs electronics for high-sensitivity focal plane arrays (FPAs)
- Develops test sets for testing new ROICs and FPAs
- Characterization of FPA-based cameras
- Probe card design
- Develop user interface software for camera operation
- Develop low-cost, small packages for cameras
- 5+ years of camera electronics design
- VHDL/Verilog programming
- Extensive mixed-signal PCB layout design
- Worked with infrared sensors
- Familiar with packaging for room-temperature and cryogenic IR sensors
- B.S. or M.S. in Electrical Engineering or Physics
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09-006 Board Design/Systems Engineer
Responsibilities- Apply knowledge of electronics, analog and digital circuits, mixed-signal PCB layout, firmware and software for application in optoelectronic systems and products
- Work closely with laser and optical detector product teams to develop the electronic interface required for system-level products
- Develop PCB-based solutions from sub-system architecture through final test and delivery to meet customer required performance specifications
- Customer contract environment that requires working towards defined statements of work and customer deliverables; analyze problems, investigate possible solutions and formulate a workable design
- End-applications include laser rangefinders, laser pointers, NIR laser illuminators and SWIR sensor heads
- Experience with schematic development, layout, software, firmware, and system test and debugging
- Background in electronics, board design, layout and systems work
- Microcontroller/digital signal controller programming experience (e.g. PIC) in assembly and/or C
- Familiarity with major IC categories, including microcontrollers or DSPs, FPGAs desired
- Experience with analog, digital, mixed signal, and RF desired
- Experience with PC control and interface desired
- SPICE simulation experience desired
- Experience with C programming
- 5 years work experience in a related field
- Bachelor or Masters level degree in Electrical Engineering or equivalent
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